Abrasive flow machining can improve complex surfaces inside valves, manifolds, fittings, and other process components using flexible abrasive media that follows the workpiece geometry.
Semiconductor Equipment Needs More Than Dimensional Accuracy
Precision machining can create an exact component geometry while still leaving microscopic surface imperfections.
These may include:
- Burrs
- Tool marks
- Surface peaks and valleys
- Cross-hole irregularities
- Small internal cavities
- Rough transitions
In high-purity semiconductor process equipment, these internal features may be undesirable.
Extrude Hone AFM specifically identifies ultrapure fluid-handling components for semiconductor fabrication as an application for AFM.How Abrasive Flow Machining Works
A semi-solid polymer containing abrasive particles is forced through selected internal passages.
The media conforms to the workpiece and contacts raised surface features.
Material is gradually removed, creating a smoother internal pathway.
Potential applications include:
- Precision valves
- Gas-distribution components
- Fluid-delivery parts
- Manifolds
- Fittings
- Cross-drilled passages
- Internal process channels
AFM can often combine deburring and polishing within the same feature.
Dallas-Fort Worth Semiconductor and Electronics Manufacturing
DFW supports semiconductor, electronics, aerospace, defense, telecommunications, and advanced manufacturing.
That industrial base includes both device-related operations and suppliers producing precision equipment components.
Parts used in gas and fluid delivery systems may require internal finishing beyond what conventional machining alone can provide.
AFM gives manufacturers a way to address these surfaces after the primary component geometry has been created.
Deburring Cross Holes
Valves and manifolds may contain intersecting drilled passages.
Machining can leave a burr where one hole enters another.
Because the feature is inside the component, conventional deburring may require difficult special tooling or may not reach the edge completely.
AFM uses the internal pathway itself to deliver abrasive media to the burr.
Improving Surface Roughness
Extrude Hone AFM publishes representative surface improvements including approximately 16–18 Ra to 3–4 Ra and 32 Ra to 8 Ra or better.Rougher starting surfaces may also be substantially improved.
The actual result depends on material, geometry, starting condition, and project requirements.
High-Purity Flow Applications
Smoother internal surfaces can reduce pronounced microscopic features within a flow path.
For semiconductor process components, this may help minimize areas where contaminants can collect and provide a better underlying surface for downstream cleaning.
AFM itself does not replace the customer's required cleanroom, cleaning, inspection, or qualification processes.
Tooling Provides Selective Control
Extrude Hone AFM uses tooling to hold the part, route abrasive media through required areas, and protect other surfaces from abrasive flow.This allows manufacturers to finish an internal pathway without unnecessarily altering the rest of the component.
Materials
AFM can be applied to aluminum, copper, bronze, titanium, Inconel, hardened metals, superalloys, and other suitable metals.
Request Dallas Semiconductor Component Finishing
Call (562) 531-2976 to discuss semiconductor component finishing for Dallas, TX with Extrude Hone AFM.
FAQs
Can AFM finish semiconductor gas-delivery components?
Suitable gas-delivery valves, manifolds, and flow passages can be evaluated for AFM.
Can AFM remove machining marks?
AFM can reduce raised surface features and substantially improve surface roughness in appropriate applications.
