Abrasive flow machining can polish and deburr passages that conventional tools cannot reach effectively by forcing flexible abrasive media through the workpiece.
For semiconductor-equipment suppliers, advanced manufacturers, and precision machining companies, this can solve difficult internal-finishing problems.
Semiconductor Components Can Be Difficult to Finish
The precision involved in manufacturing a valve, manifold, or gas-delivery component does not eliminate microscopic surface irregularities.
Drilling and machining may leave:
- Burrs
- Tool marks
- Sharp intersections
- Surface valleys
- Small cavities
- Irregular internal transitions
These features may be especially undesirable in high-purity process systems.
Extrude Hone AFM specifically lists semiconductor fabrication among its ultrapure fluid-handling applications.Abrasive Flow Machining Reaches Hidden Surfaces
A polymer media containing abrasive particles is moved through the component under pressure.
The media conforms to the shape of the passage.
As it flows, the abrasive acts on raised surface features and gradually improves the finish.
Potential semiconductor-related applications include:
- High-purity valves
- Process manifolds
- Gas-delivery components
- Fluid-control parts
- Precision fittings
- Cross-drilled passages
- Internal flow channels
Pittsburgh Advanced Manufacturing
Pittsburgh supports robotics, advanced materials, electronics, energy technology, precision machining, additive manufacturing, and research-driven manufacturing.
Companies in these sectors can participate in semiconductor and equipment supply chains even when final fabrication takes place elsewhere.
AFM provides specialized finishing for components whose internal design makes ordinary polishing difficult.
Surface Finish Improvement
Extrude Hone AFM's published surface-finishing examples include approximately:- 16–18 Ra improved to 3–4 Ra
- 32 Ra improved to 8 Ra or better
- 64 Ra improved to 16 Ra or better
- 125 Ra improved to 63 Ra or better
These results vary by component.
The workpiece material, hardness, passage size, and original surface all affect what finish is practical.
High-Purity Flow and Contamination Concerns
Microscopic surface irregularities create additional internal surface area and locations where unwanted material may remain.
Improving the finish can help create a smoother underlying metal surface for components used in clean fluid and gas-delivery systems.
AFM does not itself certify a part for semiconductor service or replace downstream cleaning.
Instead, it performs the mechanical finishing needed to remove burrs and reduce surface roughness before subsequent processing.
Deburring Internal Cross Holes
A valve or manifold may contain holes drilled from several directions.
Internal intersections can be impossible to reach directly.
AFM uses the passage as the route to the burr.
Abrasive media flows over the feature and removes raised material while simultaneously improving surrounding surfaces.
Selective Tooling
Tooling is designed to support the workpiece and control where the media travels.
Extrude Hone AFM also uses fixtures to protect non-target surfaces from abrasive flow.This helps preserve features that do not require finishing.
Material Compatibility
AFM can be used on titanium, Inconel, superalloys, hardened materials, aluminum, bronze, copper, and other suitable metals.
Request Pittsburgh Semiconductor Component Finishing
Call (562) 531-2976 to discuss semiconductor component finishing for Pittsburgh, PA with Extrude Hone AFM.
FAQs
Can AFM be used on semiconductor equipment components made from difficult alloys?
Yes. AFM can process many difficult-to-machine metals, including Inconel, titanium, and superalloys.
Can AFM polish and deburr in one process?
Yes. Depending on the workpiece, both effects can occur during abrasive flow machining.
